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by Banqiu Wu,Ajay Kumar,Sesh Ramaswami

Download 3D IC Stacking Technology ePub
  • ISBN 007174195X
  • ISBN13 978-0262691277
  • Language English
  • Author Banqiu Wu,Ajay Kumar,Sesh Ramaswami
  • Publisher McGraw-Hill Education; 1 edition (July 28, 2011)
  • Pages 544
  • Formats rtf doc lit lrf
  • Category Engineering
  • Subcategory Engineering
  • Size ePub 1462 kb
  • Size Fb2 1668 kb
  • Rating: 4.4
  • Votes: 344

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging

Ships from and sold by FightforFast. Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.

3D IC Stacking Technology covers: High density through silicon stacking (TSS) . Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds multiple patents and awards. He holds more than 100 US patents and has won many awards for innovation and commercialization.

Request PDF On Jan 1, 2011, Banqiu Wu and others published 3D IC STACKING TECHNOLOGY . 3D IC stacking technology. Book · January 2011 with 22 Reads.

3D IC stacking technology. How we measure 'reads'. See all. Item description. Don’t forget to check with neighbours, sorting office, outhouses if you are out a lot!" See all. About this item.

oceedings{Wu20113DIS, title {3D IC Stacking Technology}, author {Banqiu Wu and Ashok Kumar and .

oceedings{Wu20113DIS, title {3D IC Stacking Technology}, author {Banqiu Wu and Ashok Kumar and Sesh Ramaswami}, year {2011} }. Banqiu Wu, Ashok Kumar, Sesh Ramaswami. Chapter 1. Introduction to High-Density Through Silicon Stacking Technology Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack Chapter 4. Process Integration for TSV Manufacturing Chapter 5. High-Aspect-Ratio Silicon Etch for TSV Chapter 6. Dielectric Deposition for Through Silicon.

by Banqiu Wu, Sesh Ramaswami, Ajay Kumar. Books related to 3D IC Stacking Technology. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. by Banqiu Wu, Ajay Kumar, Sesh Ramaswami

3D IC Stacking Technology. by Banqiu Wu, Ajay Kumar, Sesh Ramaswami. ISBN 9780071741958 (978-0-07-174195-8) Hardcover, McGraw-Hill Education, 2011. Find signed collectible books: '3D IC Stacking Technology'. Founded in 1997, BookFinder

by Ajay Kumar, Sesh Ramaswami, Banqiu W.

The latest advances in three-dimensional integrated circuit stacking technology. Banqiu Wu, Ajay Kumar, Sesh Ramaswami.

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